
Intel® Embedded Alliance
Emerson Network Power Embedded Computing:
Centellis 4100 AdvancedTCA Communications Server




The Motorola CentellisTM 4100 is an AdvancedTCA platform that can be used to achieve high density at the rack level, to support front maintenance and rear cabling requirements for the central office and to address central offi ce-driven environmental requirements.
The Centellis 4100 platform integrates the chassis, cooling, power distribution, shelf management, and managed networks into an off-the-shelf platform solution on which you can add your service-related hardware and software.
With architecture designed for 5NINES availability, the Centellis 4100 PICMG® 3.0 compliant embedded AdvancedTCA packet switching backplane platform minimizes both planned and unplanned downtime and provides continuous service during fault recovery. The Centellis 4100 provides this level of protection through a combination of redundancy on the component level to avoid single points of failure; repair and upgrade of the running system without impacting the system service; remote access for monitoring, control, and upgrade; and unmistakable guidance through component replacement procedures.
The result is a high availability server ideally suited for dataintensive central office and networking applications, including media gateway controllers, VoIP concentrators, multimedia servers, signaling gateways, cable head-end, IP/DSLAM, IP PBX, and next generation wireless base station controller (BSC) systems.
In addition to redundancy of all active system components, the Centellis 4100 series supports high availability through hot-swappable key system components. Power distribution, cooling fan trays, and shelf management controllers are all hot-swappable to minimize downtime and mean time to repair (MTTR).
AdvancedTCA boards are also hot-swappable so they can be added, removed, or replaced without bringing down the system. If heat is a concern for system reliability, the chassis has been tested for cooling capacity of 200W per front slot and additional 15W per rear slot to support active components even on rear transition modules (RTMs).
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