
Intel® Embedded Alliance
DFI-ITOX:
NP900-B16C Intel® 945GSE/ICH7M COM Express Module




DFI-ACP today launches a new COM Express moduleNP900-B16C. The module is a PICMG COM Express Type 2 Basic form factor design, with a compact size of 95mm x125mm (3.74" x4.9"). This new model utilizes a 1.6GHz Intel® Atom™ processor N270 paired with a low power Intel® 945GSE/ICH7M chipset. Featuring more performance-per-watt than any previous Intel x86 architecture, the new Intel® Atom™ processor provides better graphics media support than competing low-power processors. The NP900-B16C contains one 200-pin SODIMM socket, supporting up to 2 GB DDR2 400/533 MHz memory.
In addition, this new module has one PCI Express Gigabit LAN controller, and one SDVO port supporting dual-channel LVDS and VGA graphics ports. In addition, this COM Express board supports two SATA interfaces with independent DMA operation, 8 USB 2.0/1.1 ports, 3 PCIEx1 and 4 PCI bus masters.
The value-optimized NP900-B16C COM Express solution improves time to market for the manufacturer, while reducing development and manufacturing costs. As new processor and chipset COM modules become available, the embedded engineer has the option to upgrade without having to modify expensive proprietary components.
This new DFI-ACP Intel® AtomTM based product is ideal for embedded market applications such as digital signage, ATM/POS terminals, kiosks, industrial control, gaming, medical diagnostics, interactive client, and security.
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