
Intel® Embedded Alliance
Nexcom:
VTC 3300




1. Fan-less and Rugged Design Platform
2. Wide I/O Connection Option
3. Integrated GSM/GPRS and GPS for Mobile Communication
4. Power Ignition Control
5. Dual Display for CRT and LVDS Output
6. PC/104+ Expansion
7. NVRAM Storage Back-up by Battery
8. Wide Range DC input from +6 to +36 VDC
9. ETX Platform for Quick Customization
10. Optional Vibration Bracket, External Active Cooling Kit, Cover and etc.
| Intel® Products |
|---|
Search for Other Related Intel Products
| Product Characteristics |
|---|
Search for Other Product Characteristics
| Product Support |
|---|
Search for Other Product Support
| Related Intel Product Information |
|---|
| Intel® Pentium® Mobile Processor |
For more information on Intel products used in this solution, please see these resources available from ARK, your source for information on Intel products.
Nexcom
18F, No. 716 Chung-Cheng Rd.Chung-Ho City, Taipei County 235
Taiwan, Province of China
http://www.nexcom.com Contact Us >
Resources
Intel User Login | Request Access - Intel Only | Password Help
Intel® Embedded Alliance
Most Viewed Solutions
Top-Rated Solutions
- Embedded Development Services




(5 ratings) - conga-X915 - XTX Module based on Intel® 915GME Chipset




(5 ratings) - x86 Real-Time Hypervisor




(38 ratings) - PQ7-M100G




(43 ratings) - Cheetah - EPM-32 PC/104-Plus SBC




(9 ratings)

Comments
No comments yet.